Ultrasonic Guided Wave Inspection and Characterization of Integrated Circuit Packages with Delamination

Abstract

Adhesive failure in an integrated circuit (IC) package occurs due to certain loading conditions or manufacturing induced defects such as the presence of residual moisture, foreign material or insufficient copper roughening, causing delamination between the layers and subsequent failure of the IC package. In this paper, the use of ultrasonic guided wave based nondestructive evaluation (NDE) technique is investigated to detect delamination in a large form factor IC package. Piezoelectric transducers are used as actuators and sensors and the signals obtained from controlled damaged specimens is analyzed to understand the effect of delamination on the guided wave propagation behavior. Matching pursuit decomposition (MPD), an advanced time-frequency based signal processing algorithm, is used to extract the associated guided wave features such as mode conversions due to delamination. The information is used to characterize features such as relative amplitude of the modes and time of flight. These results will be used to develop a robust damage detection framework for the rapid inspection and quality assurance of IC packages using a non-invasive NDE procedure