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Laser Cut and Chemical Release Screen Printing Approaches for Creating Substrate Sparse Sensor Networks

CALLUM BAILEY, XIYUAN CHEN, DUSTIN CALDWELL, LOIC MAXWELL, FU-KUO CHANG, SAMEH DARDONA

Abstract


Today’s SHM technology is based on either rigid or flexible intrusive substrates which increase weight, disrupt function and lead to decreased efficiency in component operation. Separating a sensor system from its original substrate is useful for many applications, including aerospace, automotive, robotics, and industrial manufacturing. This work outlines physical and chemical methods for screen printing substrate sparse sensor networks. The physical method (Laser Cut) uses a green femtosecond laser to ablate away substrate in all non-critical areas, while the chemical method (Chemical Release) dissolves all or part of the substrate to leave free-standing inks. The Laser Cut network features 17 sensor nodes, including commercially-available lead zirconate titanate (PZT), resistance temperature detector (RTD), and strain gauge sensors. The system was attached to a demonstration processing frame, with frame and network then mounted to a cylindrical surface to demonstrate the network’s capacity for conformal monitoring. Chemical release network experiments were focused on rapid screening of the most promising substrate and ink combination pairs to determine the next steps for improving the maturity of the technology. The concept fits the aviation industry ‘power-by-the- hour’ business model which leads to operational efficiency, increased safety, cost savings and additional business for original equipment manufacturers and operators.


DOI
10.12783/shm2019/32423

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