Micro-fluid Channel Embedded in LTCC Board Using a Low-Cost Fabrication Method

JUN-CHAO LIU, LIANG-MING ZHUO, DE-JIN YAN, YAO-PING JIA

Abstract


In electronic communication device fabrication, the high density integration of chips and devices in board requires the board to have good heat dissipation performance. Embedding micro-fluid channel into LTCC board is an optimal way. In this paper, a low-cost fabrication method of LTCC board with embedded micro-fluid channel was proposed. The experimental results demonstrated the effectiveness of this method for preventing the micro-fluid channel from excessive deformation or collapse. Owing to use silver pastes instead of gold pastes, the fabrication cost of LTCC board was reduced by more than 20%, which would promote the application of LTCC boards in commercial use, such 5G communication and embedded systems.

Keywords


LTCC, Micro-fluid channel, Low-cost fabrication.Text


DOI
10.12783/dteees/peems2019/33976

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